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 WAFER DICING 

THE OPTIMAL PRODUCTS FOR YOUR WAFER DICING APPLICATION

High-speed dicing spindles are the key components in machines for microchip separation – the so-called wafer dicing. Since semiconductors steadily become smaller and smaller, the mechanical sawing process must be optimized continuously to prevent chipping, saw marks and mechanical stresses on the wafers.

The high-speed dicing spindles stand out for their very rigid and low-vibration air bearings. The used high-speed motors require a suitable frequency converter due to the necessary high rotating field frequency and the low rotor volume.

Frequency converters by SIEB & MEYER can provide the necessary rotating field frequency. Thanks to their special control technology, the devices ensure a low motor heating and a low vibration of the rotor. These points have a significant effect on the quality of the machining process.  

PRODUCT OVERVIEW

 

Device series Power range Input voltage Technology Speed (frequency) Type Communication Safety functions
SD2S 0.3 .. 55 kVA 115 .. 480 VAC 2 Level PWM/Block 180,000 1/min
(3,000 Hz)
Single-axis device RS232, CAN Bus, EtherCAT, via Gateway: Profibus, Profinet STO
SD4S 0.8 .. 66 kVA 115 .. 480 VAC 2 Level PWM/Block 360,000 1/min
(6,000 Hz)
Single-axis device CANopen, EtherCAT, (Profinet, Powerlink) STO

PRODUCTS PRECISELY TAILORED FOR YOUR APPLICATION

With our experience from customized drive systems that are meanwhile produced in large series and as well as our standard devices, we are supporting you from the project planning phase to the series production.